Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502051 | Semiconductor chip including through electrode, and semiconductor package including the same | Ho Young SON, Ju Heon YANG | 2022-11-15 |
| 11492499 | Composite resin composition for steel plate for fuel tank, composite resin-coated steel plate using same, and manufacturing method therefor | Du-Hwan Jo | 2022-11-08 |
| 11362128 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha +1 more | 2022-06-14 |