Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11408323 | Exhaust manifold heat dissipation cover coupling device for thermal stress and vibration deflection | Jae Gi Sim, Seung-Hoon Lee, Jung Hyeok Lim, Yong Pyo Hong, Seong Bin Moon | 2022-08-09 |