Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217017 | Methods for processing 3D data for use in web services | Seong Do SON, Hak Jun Kim | 2022-01-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217017 | Methods for processing 3D data for use in web services | Seong Do SON, Hak Jun Kim | 2022-01-04 |