Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393243 | Structural component, electronic apparatus, and fingerprint module assembly method | Fengping Wang, Wentao Zhang | 2022-07-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393243 | Structural component, electronic apparatus, and fingerprint module assembly method | Fengping Wang, Wentao Zhang | 2022-07-19 |