Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430760 | Chip package device | Guanhong Ye, Laicun Lin, Guowen Liu, Shuai Zheng, Huafeng Zhang | 2022-08-30 |
| 11398673 | Package structure with antenna in package and communications device | Liangsheng Liu, Ming Chang, Laicun Lin, Heng Qu, Hailin Dong | 2022-07-26 |