Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462520 | Chip integration module, chip package structure, and chip integration method | Song Gao | 2022-10-04 |
| 11276645 | Encapsulation of a substrate electrically connected to a plurality of pin arrays | Nan Zhao, Wenxu Xie, Junlei TAO, Shanghsuan CHIANG | 2022-03-15 |