Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11540399 | System and method for bonding a cable to a substrate using a die bonder | Peter D. Brewer, Aurelio Lopez | 2022-12-27 |
| 11300754 | Offset patterned micro-lens and micro-optical bench including the same | Florian G. Herrault, Oleg M. Efimov, Keyvan Sayyah | 2022-04-12 |
| 11226403 | Chip-scale coherent lidar with integrated high power laser diode | Keyvan Sayyah, Raymond Sarkissian, Oleg M. Efimov | 2022-01-18 |