Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417609 | Semiconductor structure and fabrication method thereof | Deng Feng Ji, Jun Yang, You He Sha, Chen Xiao Wang, Ying Li | 2022-08-16 |
| 11233025 | Merged power pad for improving integrated circuit power delivery | Shiqun Gu, Jinghua Zhu, Hongying Zhang, Jun Xia, Wangsheng Xie +3 more | 2022-01-25 |