Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11458569 | Welding device and welding method | — | 2022-10-04 |
| 11348794 | Semiconductor film forming method using hydrazine-based compound gas | Yosuke Serizawa, Yoshikazu Ideno, Hiroaki Ashizawa, Takaya Shimizu, Seishi Murakami | 2022-05-31 |