Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488744 | Molded wire and molded cable, and wire for molded wire and cable for molded cable | Keisuke Sugita | 2022-11-01 |
| 11230651 | Adhesive film and a flat wiring member using the same | Daisuke SHANAI, Kenichi Murakami, Kazuhiko Sasada, Masanobu Yamanobe | 2022-01-25 |