Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11419213 | Multilayer flex circuit with non-plated outer metal layer | Teruhiro Nakamiya, Satoshi Nakamura, Hiroshi Matsuda | 2022-08-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11419213 | Multilayer flex circuit with non-plated outer metal layer | Teruhiro Nakamiya, Satoshi Nakamura, Hiroshi Matsuda | 2022-08-16 |