Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417445 | Fabrication of reinforced superconducting wires | Paul R. Aimone, David B. Smathers | 2022-08-16 |
| 11392257 | Copper-alloy capping layers for metallization in touch-panel displays | Shuwei Sun, Marc Abouaf, Patrick Hogan, Qi Zhang | 2022-07-19 |
| 11327587 | Current-induced dark layer formation for metallization in electronic devices | Helia Jalili, Barbara Cox | 2022-05-10 |
| 11281317 | Electronic devices having bilayer capping layers and/or barrier layers | Helia Jalili, Barbara Cox | 2022-03-22 |