Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450695 | Method for manufacturing back surface incident type semiconductor photo detection element | Yuki Yoshida, Katsumi Shibayama | 2022-09-20 |
| 11413708 | Workpiece cutting method | Takeshi Sakamoto | 2022-08-16 |
| 11367655 | Forming openings at intersection of cutting lines | Takeshi Sakamoto | 2022-06-21 |
| 11276794 | Backside illuminated semiconductor photodetection element | Yuki Yoshida, Katsumi Shibayama | 2022-03-15 |
| 11239266 | Back-illuminated semiconductor photodetection element | Yuki Yoshida, Katsumi Shibayama | 2022-02-01 |
| 11233354 | Hermetic terminal and sensor unit | Hideki Fujiwara, Kohei Tomonaga, Yasushi Hyono | 2022-01-25 |