Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227775 | Method of fabricating carrier for wafer level package by using lead frame | Sung-il Kang, Jong Hoe Ku, In Seob BAE | 2022-01-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227775 | Method of fabricating carrier for wafer level package by using lead frame | Sung-il Kang, Jong Hoe Ku, In Seob BAE | 2022-01-18 |