Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488944 | Integrated circuit package for high bandwidth memory | Namhoon Kim, Woon-Seong Kwon, Yujeong Shim | 2022-11-01 |
| 11276668 | Backside integrated voltage regulator for integrated circuits | Nam Hoon Kim, Woon-Seong Kwon, Houle Gan, Yujeong Shim, Mikhail Popovich | 2022-03-15 |
| 11264295 | Integrated circuit substrate for containing liquid adhesive bleed-out | Woon-Seong Kwon, Ryohei Urata | 2022-03-01 |
| 11264358 | ASIC package with photonics and vertical power delivery | Woon-Seong Kwon, Namhoon Kim, Ryohei Urata | 2022-03-01 |