Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11511501 | Mold and method for molding a reinforced preform | William R. Rodgers, Venkateshwar R. Aitharaju | 2022-11-29 |
| 11498318 | Class-A components comprising moldable carbon fiber | Xiaosong Huang | 2022-11-15 |
| 11453182 | Methods for forming class-A components with moldable carbon fiber | Xiaosong Huang | 2022-09-27 |
| 11331890 | Polymeric sandwich structure having enhanced thermal conductivity and method of manufacturing the same | Xiaosong Huang | 2022-05-17 |
| 11273611 | Reinforced preform and method for molding | Venkateshwar R. Aitharaju, William R. Rodgers | 2022-03-15 |