Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380581 | Interconnect structures of semiconductor devices having a via structure through an upper conductive line | Andre P. Labonte, Chanro Park | 2022-07-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380581 | Interconnect structures of semiconductor devices having a via structure through an upper conductive line | Andre P. Labonte, Chanro Park | 2022-07-05 |