Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282885 | Wafer structure and chip structure having through-hole electrical connection for bonded chips | — | 2022-03-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282885 | Wafer structure and chip structure having through-hole electrical connection for bonded chips | — | 2022-03-22 |