Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398445 | Mechanical punched via formation in electronics package and electronics package formed thereby | Christopher James Kapusta | 2022-07-26 |
YN
Youichi Nishihara
Overall (2022): #196,976 of 548,613Top 40%
1
Patents 2022