YC

Yan Cui

GE: 6 patents #45 of 2,726Top 2%
ZC Zhuhai 4Dage Technology Co.: 2 patents #1 of 1Top 100%
BC Baidu.Com Times Technology (Beijing) Co.: 1 patents #37 of 77Top 50%
CU Cornell University: 1 patents #39 of 283Top 15%
TT Taiyuan University Of Technology: 1 patents #15 of 95Top 20%
BC Baidu Online Network Technology (Beijing) Co.: 1 patents #91 of 417Top 25%
Huawei: 1 patents #1,433 of 3,814Top 40%
BU Baidu Usa: 1 patents #84 of 161Top 55%
Overall (2022): #4,493 of 548,613Top 1%
13
Patents 2022

Issued Patents 2022

Patent #TitleCo-InventorsDate
11517969 Weld-brazing techniques Michael Douglas Arnett, Matthew Joseph Laylock, Brian Lee Tollison 2022-12-06
D970583 Camera 2022-11-22
11453949 Methods of forming desired geometry on superalloy part using powder mixture of low and high melt temperature superalloys Matthew Joseph Laylock, Brian Lee Tollison 2022-09-27
11426822 Braze composition and process of using Michael Douglas Arnett, Ethan Conrad Schaeffer, Brian Lee Tollison, Matthew Joseph Laylock 2022-08-30
11382368 Soft robotic fabrics and methods for same Jintu Fan, Dahua SHOU 2022-07-12
11384414 Nickel-based superalloys Jon Conrad Schaeffer, Michael Douglas Arnett, Matthew Joseph Laylock, Brian Lee Tollison 2022-07-12
11377962 Closure element with extensions for internal passage of component Michael Douglas Arnett, Matthew Joseph Laylock, Brian Lee Tollison 2022-07-05
11326251 Method for preparing surface-active onion-like carbon nanospheres based on vapor deposition Lei Qin, Weifeng Liu, Xuguang Liu, Yongzhen Yang 2022-05-10
11283545 Modulation method and apparatus Xi Yan, Huixiao Ma, Wai Kong Raymond Leung, Long Luo 2022-03-22
11281860 Method, apparatus and device for recognizing text type Aizhen Yue, Hui Zhao, Xian Gao, Sijiang Wang, Jing Tan 2022-03-22
11240429 Target object elimination method based on panoramic camera 2022-02-01
11235405 Method of repairing superalloy components using phase agglomeration Brian Leslie Henderson, Paul A. Cook, Daniel James Dorriety 2022-02-01
11219141 Fan-less chiller-less liquid-air cooling for electronic racks of IT components in data centers Tianyi Gao, Xiaogang Sun, Ali Heydari 2022-01-04