Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476188 | Fabrication of embedded die packaging comprising laser drilled vias | — | 2022-10-18 |
| 11342248 | Embedded die packaging for power semiconductor devices | Greg P. Klowak | 2022-05-24 |