Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11472957 | Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module | Kazuki Iwaya | 2022-10-18 |
| 11230617 | Resin composition | Kazuki Iwaya | 2022-01-25 |