Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482437 | Support, adhesive sheet, laminated structure, semiconductor device, and method for manufacturing printed wiring board | Masanori Ohkoshi, Hirohisa Narahashi | 2022-10-25 |
| 11259412 | Through hole filling paste | Hideki Ooyama, Takayuki Tanaka | 2022-02-22 |