Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11501980 | Semiconductor module, method for manufacturing semiconductor module, and level different jig | Takashi Masuzawa, Hiromichi Gohara | 2022-11-15 |
| 11355373 | Assembly jig set and manufacturing method of semiconductor module | Takeshi Yokoyama, Masaki Maruyama | 2022-06-07 |