Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502054 | Semiconductor device assembly and method therefor | — | 2022-11-15 |
| 11427464 | Packaged pressure sensor device | Weng F. Yap, Sandeep Shantaram | 2022-08-30 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502054 | Semiconductor device assembly and method therefor | — | 2022-11-15 |
| 11427464 | Packaged pressure sensor device | Weng F. Yap, Sandeep Shantaram | 2022-08-30 |