Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11233002 | High density low power interconnect using 3D die stacking | Ferran Martorell | 2022-01-25 |
PS
Prasad Subramaniam
Overall (2022): #297,300 of 548,613Top 55%
1
Patents 2022