Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380414 | TSV auto repair scheme on stacked die | — | 2022-07-05 |
| 11275111 | Plurality of edge through-silicon vias and related systems, methods, and devices | — | 2022-03-15 |
| 11244888 | Memory core chip having TSVs | Seiji Narui | 2022-02-08 |