PL

Po-Chuan Lin

ET Egalax_Empia Technology: 2 patents #5 of 7Top 75%
Overall (2022): #120,897 of 548,613Top 25%
2
Patents 2022

Issued Patents 2022

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11367710 Multi-chip package structure having dummy pad disposed between input/output units — 2022-06-21
11355476 Multi-chip package structure having dummy pad disposed between input/output units — 2022-06-07