Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11254566 | Preparation method of bionic adhesive material with tip-expanded microstructural array | Zhendong Dai, Keju Ji, Enhua Cui, Jian-Hong Chen, Yiqiang Tang | 2022-02-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11254566 | Preparation method of bionic adhesive material with tip-expanded microstructural array | Zhendong Dai, Keju Ji, Enhua Cui, Jian-Hong Chen, Yiqiang Tang | 2022-02-22 |