Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11466379 | Manufacturing method of copper foil and circuit board assembly for high frequency signal transmission | Fu CHEN, Kuo-Chao Chen | 2022-10-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11466379 | Manufacturing method of copper foil and circuit board assembly for high frequency signal transmission | Fu CHEN, Kuo-Chao Chen | 2022-10-11 |