Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495697 | Optical component packaging structure | Yi-Chang Chang, Yen-Hsin Chen | 2022-11-08 |
| 11222866 | Package process and package structure | Jen-Chuan Chen, Tommy Pan | 2022-01-11 |
CS
Chi-Chih Shen
Advanced Semiconductor Engineering: 1 patents #77 of 236Top 35%
Overall (2022): #169,904 of 548,613Top 35%
2
Patents 2022