Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11519865 | Crack detection method | — | 2022-12-06 |
| 11489299 | Processing apparatus | — | 2022-11-01 |
| 11430696 | Wafer processing method | — | 2022-08-30 |
| 11387133 | Wafer processing method | — | 2022-07-12 |
| 11380550 | Wafer processing method | — | 2022-07-05 |
| 11370084 | Cutting blade shaping method | — | 2022-06-28 |
| 11367656 | Wafer processing method | — | 2022-06-21 |
| 11364573 | Laser processing apparatus including imager of mark of processed workpiece | — | 2022-06-21 |
| 11328956 | Wafer processing method | Hisayuki Yamaoka | 2022-05-10 |
| 11322404 | Wafer processing method | — | 2022-05-03 |
| 11322403 | Wafer processing method | — | 2022-05-03 |
| 11285565 | Laser processing method | — | 2022-03-29 |