Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538704 | Processing method of workpiece | Yoshio Watanabe, Hiroyuki Takahashi | 2022-12-27 |
| 11363719 | Wiring substrate and component built-in wiring substrate | Hiroyasu Noto | 2022-06-14 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538704 | Processing method of workpiece | Yoshio Watanabe, Hiroyuki Takahashi | 2022-12-27 |
| 11363719 | Wiring substrate and component built-in wiring substrate | Hiroyasu Noto | 2022-06-14 |