Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469120 | Device and method for attaching protective tape to semiconductor wafer | Yoshinori KAKINUMA, Yosuke Ishimatsu, Ken Ikehata | 2022-10-11 |
| 11437275 | Method of processing wafer and protective sheeting for use in this method | — | 2022-09-06 |
| 11424161 | Substrate processing method | Tzanimir Arguirov, Yasuyoshi Yubira | 2022-08-23 |