Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476137 | Dividing apparatus including an imaging unit for detecting defects in a workplace | Ken JOU | 2022-10-18 |
| 11462439 | Wafer processing method | Keita OBARA, Shinya Honda | 2022-10-04 |