Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11357097 | High performance thermal solution concept for surface mount device packages | Yung You Lin, Hung-Cheng Chang | 2022-06-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11357097 | High performance thermal solution concept for surface mount device packages | Yung You Lin, Hung-Cheng Chang | 2022-06-07 |