Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11452239 | Method for enhancing boiling performance of chip surface | Jisheng He, Chen Wang, Peng Zhang, Hongjie Wu, Jingnan Peng +2 more | 2022-09-20 |
| 11404735 | Immersed heat dissipation device for power battery | Jisheng He, Peng Zhang, Bingshuang Li, Chen Wang, Hongjie Wu +5 more | 2022-08-02 |
| 11317536 | High-efficiency phase-change condenser of a supercomputer | Jisheng He, Lei Han, Bingshuang Li, Jiawei Liu, Yingjun Wu +5 more | 2022-04-26 |