Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11371782 | Heat exchanger with parallel flow features to enhance heat conduction | Noman Rahim, Allan K. So, Lee M. Kinder, Michael Bardeleben, Benjamin A. Kenney | 2022-06-28 |
| 11326837 | Heat exchanger with internal manifold structure | Jiang Feng Yu | 2022-05-10 |