Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11429081 | Toolpath topology design method based on vector field in sub-regional processing for curved surface | Jianwei Ma, Xiao Lu, Wenwen Jiang, Xiaoxuan Zhao, Wei Liu +1 more | 2022-08-30 |
| 11287400 | Large-panel ultrasonic on-machine non-contact scanning thickness measurement equipment and thickness measurement method | Yongqing Wang, Haibo Liu, Te LI, Meng Lian, Kuo Liu | 2022-03-29 |