Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437548 | Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods | — | 2022-09-06 |
| 11417635 | High density pixelated-LED chips and chip array devices | — | 2022-08-16 |
| 11411148 | Light-emitting diode package with light-altering material | Kyle Damborsky, Derek Miller, Jack Vu, Jasper Cabalu, Colin Blakely +1 more | 2022-08-09 |
| 11387221 | High density pixelated LED and devices and methods thereof | John Edmond, Matthew Donofrio, Jesse Colin Reiherzer, Joseph G. Clark, Kevin Haberern | 2022-07-12 |
| 11270897 | Apparatus and methods for mass transfer of electronic die | Christopher P. Hussell | 2022-03-08 |
| 11251164 | Multi-layer conversion material for down conversion in solid state lighting | Fan Zhang, James Ibbetson, Bernd Keller, Thodore Lowes, Antony Paul Van De Ven +2 more | 2022-02-15 |