Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11254567 | Method for encapsulating a microelectronic device, comprising a step of thinning the substrate and/or the encapsulation cover | Messaoud Bedjaoui | 2022-02-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11254567 | Method for encapsulating a microelectronic device, comprising a step of thinning the substrate and/or the encapsulation cover | Messaoud Bedjaoui | 2022-02-22 |