Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380648 | Process for manufacturing assembly pads on a carrier for the self-assembly of an electronic circuit on the carrier | Jean Berthier, Nicolas Posseme | 2022-07-05 |
| 11305372 | Method of assembly by direct bonding between two elements, each element comprising portions of metal and dielectric materials | Yann Beilliard | 2022-04-19 |