Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11291578 | Adhesive wafer with an integrated release layer | Anders Grove Sund, Esben Stroebech, Philip Holler Langhorn, Michael Hoejstroem | 2022-04-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11291578 | Adhesive wafer with an integrated release layer | Anders Grove Sund, Esben Stroebech, Philip Holler Langhorn, Michael Hoejstroem | 2022-04-05 |