Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11463350 | Interconnecting local RPL instance nodes via global RPL instance node as AODV relay | Ling Wei, Wenjia Wu, Chuanwei Li | 2022-10-04 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11463350 | Interconnecting local RPL instance nodes via global RPL instance node as AODV relay | Ling Wei, Wenjia Wu, Chuanwei Li | 2022-10-04 |