Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11350518 | Method of attaching heat sinks to a circuit tape | Chia-Sung Lin, Huan-Kai Chou, Chia-Hsin Yen | 2022-05-31 |
| 11322437 | Flip chip interconnection and circuit board thereof | Yu Ma, Hsin-Hao Huang, Gwo-Shyan Sheu | 2022-05-03 |
| 11309238 | Layout structure of a flexible circuit board | Yu Ma, Hsin-Hao Huang, Gwo-Shyan Sheu | 2022-04-19 |