Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11531057 | Through-silicon via crack detecting apparatus, detecting method, and semiconductor device fabrication method having the same | Chih-Wei Chang | 2022-12-20 |
| 11408929 | Through-silicon via detecting circuit, method and integrated circuit having the same | — | 2022-08-09 |