Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11536770 | Chip test method, apparatus, device, and system | — | 2022-12-27 |
| 11488653 | Power supply system and semiconductor package assembly | — | 2022-11-01 |
| 11482272 | Power supply system and semiconductor package assembly | — | 2022-10-25 |
| 11348873 | Wafer stacking method and wafer stacking structure | Ling-Yi Chuang | 2022-05-31 |
| 11320484 | Test method and test system | — | 2022-05-03 |