Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11493280 | Heat pipe module and heat dissipating device using the same | Te-Hsuan Chin | 2022-11-08 |
| 11313628 | Thermal conducting structure | Te-Hsuan Chin, Lei Liu | 2022-04-26 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11493280 | Heat pipe module and heat dissipating device using the same | Te-Hsuan Chin | 2022-11-08 |
| 11313628 | Thermal conducting structure | Te-Hsuan Chin, Lei Liu | 2022-04-26 |