Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11420282 | Soldering device | Miki Hiraoka, Shinya Kawakita, Masayuki Kyoi | 2022-08-23 |
| 11244877 | Sealing structure and manufacturing method thereof | Tetsuya Nakatsuka, Shinya Kawakita, Susumu Ishida, Isamu Yoshida | 2022-02-08 |