Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11440850 | Powder for additive modeling, structure, semiconductor production device component, and semiconductor production device | Hisato Yabuta, Kanako Oshima | 2022-09-13 |
| 11285661 | Powder for ceramic shaping and ceramic shaping method using the same | Hisato Yabuta, Kanako Oshima, Akira Tsuboyama | 2022-03-29 |